Immersion cooling for data centers


Fluorack™ FRK-fluids are non-conductive, non-flammable, stable, and have good compatibility to electronic compounents. Those fluids can be deployed to directly immerse the IT hardwares in a dielectric liquid media, and heat generated by the electronic components is directly and efficiently transferred to the fluid. The superior efficiency achieved by direct liquid cooling can help to improve PUE(Power Usage Effectiveness) to be lower than 1.1, while reducing costs and dependency on natural resources. The non-flammble and low GWP features of FRK-fluids can meet the demands from industry about reliability and sustainbility.

Immersion cooling with Fluorack™ FRK thermal management fluids can help improve efficiency while reducing costs and dependency on natural resources center — from design and construction to maintenance and operations. A next-generation data center is right around the corner

Benefits with immersion cooling by FRK-fluids

Geographically and environmentally agnostic

Deploy data centers with more consistent cooling infrastructure globally, regardless of location decisions.

Simpler data center designs to scale more efficiently

Scale more efficiently with compact data centers and simple data center topologies (e.g., mechanical, electrical, networking). Simplify data center design by eliminating the need for complex airflow management.

Reduce capital and operational expenses

Address new workload needs while reducing capital expenditure by minimizing or eliminating air-cooling infrastructure (e.g., chillers, CRACs, CRAHs, PDUs, RPPs, telecom/networking, facility footprint). With increased cooling efficiency, electricity costs dedicated to ancillary cooling needs can be reduced.

Reduce PUE(Power Usage Effectiveness) and water usage

With PUEs as low as 1.1 and below, more power-efficient and sustainable data centers are realized. Also, reduce or eliminate water waste with immersion cooling through the use of dry coolers.




  • PUE reduction down to lower than 1.1

  • High dielectric and low impact to signals

  • Nonflammable

  • Stable and compatible